Integrated Semiconductor Outline Package

ABSTRACT

A transistor outline package is provided for a semiconductor integrated device suitable for use in a control module of an automobile for connection between a printed circuit board and a bus bar of such a module. The package includes a package housing, having a first end suitable for mounting to a PCB and which has a width. The package is also formed with a leadframe which includes a heat sink and ground plane blade suitable for connection to a bus bar, a plurality of connector leads suitable for connection to a PCB and at least one source tab lead suitable for connection to a module connector of such a control module. The plurality of connection leads and the source tab lead extend from the first end of the package housing side by side in the direction along and within the width of the first end of the package housing.

This application is a divisional of patent application Ser. No.12/513,906, filed on May 7, 2009, which is a national stage ofinternational application number PCT/SG06/00379, filed on Dec. 5, 2006,which applications are incorporated herein by reference.

BACKGROUND

This invention relates to an integrated semiconductor outline packageand refers particularly, but not exclusively, to a transistor outlinepackage for connection between a printed circuit board (PCB) and a busbar of a control module of an automobile.

Electrical power distribution systems for automobiles, typically includea control module that provides centralized control of the electroniccomponents of the automobile. A conventional control module includes ajunction box, which is commonly referred to as a smart junction box. Thejunction box includes a housing that contains one or more layers ofPCBs, which support semiconductor integrated devices. The control modulealso includes module connectors to provide electrical connectionsbetween the control module and the electronic components of theautomobile.

Some of the devices mounted on the PCBs of the control module generatesignificant amounts of heat. Such devices are generally provided intransistor outline (TO) packages so as to provide heat dissipation andthere is an increasing demand for TO packages which provide high levelsof heat dissipation.

The United States Council for Automotive Research (USCAR) maintainsstrict requirements for the mounting of TO packages on a PCB in suchcontrol modules, such as limitations on terminal (pin) thickness andwidth, as well as pin to pin pitch and pin row to pin row pitch, whichplace restrictions on the leadframe design of TO packages.

SUMMARY OF INVENTION

A semiconductor package is provided with a heat sink blade which extendsfrom an end of the package so as to provide heat sinking from thepackage to an external heat sink. The package is also provided with aset of leads having portions which extend side-by-side from an oppositeend of the package and within a width measurement of the package. Atleast one of the leads is a connection lead suitable for surfacemounting on a printed circuit board and at least one of the leads is asource tab lead suitable for through mount connection to a moduleconnector or transitions into such a module connector. The heat sinkblade and the set of leads are formed from the package leadframe. Toprovide space for the connection leads within the width measurement, thesource tab lead is formed with a neck portion.

BRIEF DESCRIPTION OF DRAWINGS

There shall now be described by way of some none limiting embodiments,the description being with reference to the accompanying illustrativedrawings. In the drawings:

FIG. 1 is a schematic illustration of a structure of a typical controlmodule for an automobile;

FIG. 2 is a front view of an embodiment of a TO package according to thepresent invention connected to a PCB;

FIG. 3 is a side view of the TO package of FIG. 2;

FIG. 4 is a plan view of the TO package of FIG. 2;

FIG. 5 is a front view of an embodiment of a TO package according to thepresent invention connected to a PCB;

FIG. 6 is a side view of the TO package of FIG. 5;

FIG. 7 is a perspective view of the TO package of FIG. 5;

FIG. 8 is a perspective view of a TO package according to the presentinvention connected between a PCB and a bus bar heat spreader;

FIG. 9 is a perspective view of the TO package of FIG. 8;

FIG. 10 is a side view of the TO package of FIG. 8; and

FIG. 11 is a view of the underside of the TO package of FIG. 8.

DETAILED DESCRIPTION

FIG. 1 shows schematically a control module for an automobile, alsoknown as a smart junction box. The control module comprises a housing(2), within which is housed an electronic driver (4) comprisingmulti-layered PCBs on which are mounted various electronic componentswhich together perform the functionality of the control module. Theelectronic driver (4) is connected to the various electronic componentsof the automobile via a fuse and relay PCB (6) on which are mountedvarious electronic components which together perform the functionalityof the fuse and relay PCB. A metallic heat spreading bus bar (8) islocated within the housing between the multi-layered PCBs of theelectronic driver (4) and the fuse and relay PCB (6) and acts as a heatsink and ground plane for the components mounted on at least the fuseand relay PCB (6). The fuse and relay PCB (6) is connected to theelectronic components of the automobile via a plurality of moduleconnectors or spade output terminals (10).

The fuse and relay PCB (6) has a plurality of semiconductor IC highpower MOSFET devices mounted on it. The high power MOSFET devicesgenerate a lot of heat and so are generally provided in the form of atransistor outline (TO) integrated package.

Conventionally separate components are required for making a connectionbetween the TO package and the module connectors (10) and for making aconnection between the TO package and the bus bar (8). The TO packagesdescribed herein are integrated with a source tab lead (106, 109, 206)for making a direct connection to or which transition into a moduleconnector (10) and are integrated with a bus bar connector (16, 116).The TO packages described herein also offer the possibility of acombination of through hole and surface mount connection to a PCB, whichprovides a very stable mounting, while meeting the USCAR pitchrequirements for the mounting of the TO packages on the fuse and relayPCB (6).

One embodiment of a TO package (12), is shown in FIGS. 2 to 4. The TOpackage (12) is suitable for use in a control module of an automobile,for example, of the type described above in relation to FIG. 1. The TOpackage (12) is suitable for connection between a printed circuit board(PCB), for example a fuse and relay PCB (6), and a bus bar (8) of such amodule. The TO package (12) comprises a leadframe and a semiconductorintegrated device (15) encapsulated together in a package housing (14)to form the package (12). The package housing (14) will generally beplastic molded over the device and leadframe.

In the embodiments of the invention described herein, the width (w) ofthe package housing (14) is marked on the Figures and is the largestdimension of the package housing extending substantially parallel to thePCB (6) on which the package is mounted. The width measurements referredto herein extend substantially parallel to the width (w) marked in theFigures. If a pair of parallel planes are constructed, one at either endof the width measurement (w), so that the width dimension is normal toboth of the planes, the phrase ‘extending within the width’ is definedas extending within the space bounded by these two planes. A firstdirection is also defined herein, as the general direction in which thefirst portions of the connection leads (18 b) and the neck portion orportions of the source tab lead or leads (106, 109, 206) extend side byside. In the embodiments described herein, the first direction issubstantially parallel to the width dimension, and for the purpose ofillustration is marked on FIG. 9, as direction (D). In the embodimentsdescribed herein the width (w) of the package housing is substantiallythe same from the upper end (14 a) to the lower end (14 b) of thepackage housing.

The TO package (12) has a leadframe, generally formed from a planarblank which is suitably stamped and folded. The leadframe isencapsulated with a semiconductor integrated device (15), as is wellknown in the art. Connector leads (18) extend from a first lower end (14b) of the package housing, each having first portions (18 b) adjacent tothe first end of the package housing. In addition, a source tab lead(106) extends from the first end (14 b) of the package housing. A heatsink and ground plane blade (16) extends from a second end (14 a) of thepackage housing. In the embodiment of FIGS. 2 to 4, the first and secondends of the package housing are opposite ends of the package housing.The source tab lead (106) is formed with a neck portion (106 a) whichhas a width less than the width (w) of the first end (14 b) of thepackage housing. This provides space for the first portions (18 b) ofthe connection leads (18) and for the neck portion (106 a) of the sourcetab lead (106) to depend side by side from the first end (14 b) of thepackage housing within the width of the package housing, as is shownparticularly in FIG. 2.

The TO package is mounted on the upper side of the fuse and relay PCB(6) with the source tab lead (106) connecting through a slot in the PCB(6) to a module connector (10) which extends below the PCB (6) and outof the control module housing (2). Thus the TO package (12) is providedwith a source tab lead (106) suitable for through hole connection to amodule connector (10) through the PCB (6).

The package housing (14) has a uniform width (w) and the leadframe, orat least a blank from which the leadframe is formed has a uniform width(w′).

The leadframe of the TO package (12) forms a plurality of leads (18,106), which extend from the package housing (14), each lead having afirst portion (18 b, 106 a) adjacent to and depending from the lower endof the package housing so that these first portions (18 b, 106 a) fitwithin the width (w) of the first end of the package housing. One of theleads (106) is the source tab lead suitable for connection to a moduleconnector (10) and the other leads (18) are connector leads suitable forconnection to the PCB (6).

A heat sink blade (16) is formed from the leadframe of the package (12)and acts to dissipate heat from the high power MOSFET device (15)encapsulated in the package (12) as well as providing a ground planeconnection. The heat sink blade (16) extends upwardly from the uppersecond end (14 a) of the package housing (14). When the TO package (12)is mounted on the fuse and relay PCB (6), the end of the heat sink blade(16) remote from the package housing (14) contacts the bus bar (8) ofthe control module. In this way heat is dissipated from the package(12), along the heat sink blade (16) to the bus bar (8).

The source tab lead (106) is also formed from the package leadframe andprovides an electrical connection to the MOSFET device (15) of thepackage (12) and extends from the lower first end (14 b) (opposite tothe upper end (14 a)) of the package housing (14). The module connector(10) which has a width similar to the width of the package housing (14)extends laterally offset to and below the package and is connected tothe end of the source tab lead (106) remote from the package housing(14). In order to provide space for the plurality of leads (18), thesource tab lead (106) is formed with a reduced width, as compared to thewidth (w) of the package housing (14) and the width of the moduleconnector (10). The source tab lead (106) has a neck portion (106 a)which extends downwardly from the lower end (14 b) of the packagehousing. The source tab lead (106) then bends through 90 degrees to forma second part (106 b) which extends along the upper surface of the fuseand relay PCB (6) laterally of the first direction. It then bendsthrough a further 90 degrees to form a third part, which extendssubstantially parallel, but laterally offset, to the first part andextends through a slot in the fuse relay PCB (6). The third part of thesource tab lead (106) is a through hole connected to the source tab(10), which forms the module connector.

Thus, the package (12) has a source tab lead (106) which is suitable forconnection at its end remote from the package housing (14) to a moduleconnector (10). The module connector (10) extends below and yet withinthe width (w) of the package housing. Thus, the first portions (18 b) ofthe connection leads (18) depend from the first end (14 b) of thepackage housing into a space to the side of the neck portion (106 a) ofthe source tab lead (106) below the first end (14 b) of the packagehousing and above the module connector (10). In this way the firstportions (18 b) of the connection leads (18) and the neck portion (106a) of the source tab lead (106) extend side by side in a line within thewidth (w) of the package housing (14). This side-by-side arrangementenables the integrated TO package to meet the pin to pin pitch and pinrow to pin row pitch requirements of USCAR (mentioned above).

In the embodiment of the present invention shown in FIGS. 2 to 4, theplurality of connection leads (18) are suitable for drain, gate andother logic connections between the MOSFET device (15) of the package(12) and the fuse and relay PCB (6) by SMD mounting. The connectionleads (18) are formed from the package leadframe and are designed tomake suitable electrical connections to the device (15) encapsulatedwithin the package (12), as is well known in the art. These leads (18)have a first portion (18 b) extending downwardly of the lower first end(14 b) of the package housing (14). Each first portion transitions via a90 degree bend into a second portion (18 a) which extends laterally tothe first direction along the upper surface of the PCB (6) sofacilitating SMD mounting of the TO package onto the fuse and relay PCB(6). As can be seen in FIG. 3, the second portions (18 a) of theconnection leads bend to one side so as to extend laterally of the firstdirection.

Another embodiment of the TO package according to the present inventionis shown in FIGS. 5 and 6, with like parts shown by like numerals. Themain difference between the embodiment of FIGS. 2 to 4 and that of FIGS.5 and 6 is the configuration of the leads. In the embodiment of FIGS. 5and 6 there are two source tab leads (109) one to each side of aplurality of connector leads (18).

In the embodiment of FIGS. 5 and 6, a pair of source tab leads (109) areformed from the package leadframe and extend from the lower first end(14 b) (opposite to the upper second end (14 a)) of the package housing(14). A common module connector (10) which again has a width similar tothe width of the package (12) is connected to the ends of the source tableads (109) remote from the package housing (14). The source tab leads(109) and module connector (10) can be connected by dual source wirebonding so as to form a through hole mounting for the package (12) onthe PCB (6). In order to provide space for the plurality of leads (18),a space is provided between the pair of source tab leads (109). In thisembodiment source tab leads (109) and the module connector extend in thesame plane, downwardly from the lower first end (14 b) of the packagehousing (14).

The spaced source tab leads (109) enable the leadframe of the package(12) to be formed with a plurality of connection leads (18) that extendfrom the lower end (14 b) of the package housing, without any of theleads extending beyond the width (w) of the package (12). That is, thesource tab leads (109) which are formed as neck portions and the firstportions (18 b) of the plurality of leads (18) extend side-by-side fromthe lower end (14 b) of the package, along the width (w) of the package,but not beyond. This side-by-side arrangement enables the integrated TOpackage (12) shown in FIGS. 4 and 5 to meet the pin to pin pitch and pinrow to pin row pitch requirements of USCAR (mentioned above). The sourcetab leads (109) and the first portions (18 b) of the connector leads(18) extend side by side, preferably along a line in the firstdirection.

Again, the plurality of connection leads (18) are suitable for drain,gate and other logic connections between the MOSFET device (15)encapsulated within the package (12) and the fuse and relay PCB (6) bySMD mounting. The connection leads (18) are formed from the packageleadframe and are designed to make suitable electrical connections tothe encapsulated device (15), as is well known in the art. These leads(18) have a first portion (18 b) extending downwardly of the lower end(14 b) of the package housing. The first portions (18 b) of theconnection leads and the neck portions (109) of the source tab leadsextend side by side in the first direction. In FIG. 5, the firstdirection is in the plane of the paper substantially parallel to thewidth dimension and in FIG. 6 it extends normally to the plane of thepage. Each first portion (18 b) transitions into a second portion (18 a)which extends laterally of the first direction, along the upper surfaceof the PCB (6) so facilitating SMD mounting of the TO package onto thefuse and relay PCB (6).

Thus, the source tab leads (109) are formed as neck portions having awidth, and a combined width less than the width (w) of the packagehousing and less than the width of the module connector (10). Thisprovides space for the first portions (18 b) of the connector leads (18)and the source tab leads (109) to depend side by side from the lower end(14 b) of the package housing within the width (w) of the packagehousing (14).

As is shown in FIG. 7, the leads (18) can be bent so as to extend inopposing directions, laterally of the first direction so as to enablehigh stability SMD type mounting on the PCB (6). In FIG. 7 a first setof the connection leads (the lead (18) extending to the left in FIG. 7)bend to one side so as to extend laterally in a first direction alongthe surface of the PCB (6) and a second set of the connection leads (thetwo leads (18) extending to the right in FIG. 7) bend in a directionopposite to said first side along the surface of the PCB (6).

A further embodiment of the present invention is shown in FIGS. 8 to 11,with like parts shown with like numerals to the first embodiment. Themain differences between the first and third embodiments are themounting of the head sink blade (116) on the bus bar (8) and theconfiguration of the source tab lead (206) and module connector (10).

As shown in FIG. 8, this embodiment of the TO package (12) is mounted onthe upper side of the fuse and relay PCB (6) with the source tab (10)extending below a slot in the PCB (6) so that the source tab (10)extends below the PCB (6) and out of the control module housing (2), soas to form a module connector. The heat sink blade (116) which is formedfrom the package leadframe, has a first portion which extends upwardlyfrom the upper second end (14 a) of the package housing. The firstportion transitions into a second portion of the heat sink blade througha 90 degree bend, so that the second portion of the heat sink blade(116) extends parallel to and along the lower surface of the bus bar(8). The second portion of the heat sink blade is formed with a throughhole (17) which enables connection to the bus bar (8) via a screw (26).The screw (26) passes through a hole in the bus bar (8) and through thehole (17) so as to form a rigid connection between the heat sink blade(116) and the bus bar (8). This provides improved heat dissipation fromwithin the package housing (14), along the heat sink blade (116) to thebus bar (8).

Again the source tab lead (206) is also formed from the packageleadframe and provides an electrical connection to the MOSFET device(15) encapsulated within the package (12) and extends from the lowerfirst end (14 b) of the package housing. The module connector (10) whichhas a width similar to the width of the package housing (14) isconnected to or is formed integrally with the end of the source tab lead(206) remote from the package housing. In order to provide space for theplurality of connection leads (18), the source tab lead (206) is formedwith a neck portion (206 a) of reduced width, as compared to the widthof the package housing (14) and the width of the module connector (10).The width dimensions are measured in a direction substantially parallelto a first direction (D) identified in FIG. 9. The source tab lead (206)has a first neck portion (206 a) which extends downwardly from the lowerend (14 b) of the package housing (14). The source tab lead (206) thenbends through 90 degrees to form a second part (206 b) which extendsalong the upper surface of the fuse and relay PCB (6), laterally to thefirst direction (D). The second part (206 b) then transitions into afirst part of the module connector (10), which has a similar width asthe package housing (14) and which continues to extend along the uppersurface of the PCB (6). The first part of the module connector (10) thenbends through 90 degrees to form a second part, which extendssubstantially parallel, but laterally offset, to the first part of thesource tab lead (206) and extends through a slot in the fuse and relayPCB (6) and below the PCB (6).

The reduced width neck portion (206 a) of the source tab lead (206)enables the leadframe of the package (12) to be formed with a pluralityof connection leads (18) that extend from the lower first end (14 b) ofthe package housing, without the leads extending beyond the width (w) ofthe package housing (14). That is, the source tab lead neck portion (206a) and first portions (18 b) the plurality of leads (18) extendside-by-side from the lower end (14 b) of the package housing, along thewidth of the package housing, but not beyond, as is shown particularlyin FIG. 9. This side-by-side arrangement enables the integrated TOpackage according this embodiment to meet the pin to pin pitch and pinrow to pin row pitch requirements of USCAR (mentioned above).

The neck portion (206 a) of the source tab lead (206) and the firstportions (18 b) of the connection leads (18) extend side by side,preferably along a line. In FIG. 9, the leads extend side by side in afirst direction aligned with the arrow marked (D), and substantiallyparallel to the width measurement (w). In FIG. 10 the first directionextends perpendicularly of the plane of the paper, extending from theshaded area (A) where lead portions (206 a, 18 b) overlap.

The plurality of connection leads (18) are suitable for drain, gate andother logic connections between the MOSFET device (15) encapsulatedwithin the package (12) and the fuse and relay PCB (6) by SMD mounting.The leads (18) are part of the package leadframe and are designed tomake suitable electrical connections to the encapsulated device (15), asis well known in the art. These leads (18) have a first portion (18 b)extending downwardly of the lower end (14 b) of the package housing.Each first portion transitions via a 90 degree bend into a secondportion which extends along the upper surface of the PCB (6), laterallyto the first direction (D) so facilitating SMD mounting of the TOpackage onto the fuse and relay PCB (6). In this third embodiment, theleads (18) bend in the opposite direction to the source tab lead (206).Both the connection leads (18) and the source tab lead (206) bend so asto extend laterally of the first direction (D).

In the embodiment of FIGS. 8 to 11, the source tab (206) is formed witha neck portion (206 a) adjacent to the first end (14 b) of the packagehousing (14). This neck portion (206 a) has a width less than the width(w) of the package housing (14) and less than the width of the moduleconnector (10). This provides space for the first portions (18 b) of theconnector leads (18) and the neck portion (206 a) of the source tab lead(206) to depend side by side from the first end of the package housing,within the width of the package housing (14).

A control module of an automobile, of the type described in relation toFIG. 1, has a housing (2) containing at least one PCB and at least onemetallic bus bar (8) and comprises a plurality of module connectors (10)for connecting the control module to electronic components of such anautomobile. The control module may additionally comprise at least one TOpackage according to any of the embodiments of FIGS. 2 to 11, in which,for each TO package, the heat sink blade (16, 116) is connected to theor one of the bus bars (8) so as to dissipate heat from the package(12), the connector leads (18) are connected to the or one of the PCBsand the source tab lead (106, 109, 206) is connected to or transitionsinto one of the module connectors (10).

In the embodiments described in relation to FIGS. 1 to 11, the or eachsource tab (106, 109, 206) includes a relatively narrow portion, theneck or first portions (106 a, 109 a, 206 a), near to the packagehousing (14) for connection to a wider module connector (10) furtheraway from the package housing (14). The relatively narrow portion can beconnected to a module connector (10) via through hole connection, e.g.via a slot in the printed circuit board (6). Alternatively, as shown inthe embodiment of FIGS. 8 to 11, the source tab (206) can transitioninto the module connector (10), which module connector then passesthrough the PCB (6). The relatively narrow portion (106 a, 109 a, 206 a)enables some overlap in the width dimension between the first portions(18 b) of the connector leads (18) and the relatively narrow portions(106 a, 109 a, 206 a) of the source tab lead. For example in FIG. 3, thenarrow portion (106 a) is behind the first portions of the connectionleads (18) and so these overlap in the width direction, i.e., in adirection normal to the plane of the paper in FIG. 3. In FIG. 6, thefirst portions of the connection leads (18) and one of the source tableads are behind the other of the source tab lead (109 a), and so againthese overlap in the width direction, normal to the plane of the paperin FIG. 6.

1. A control module of an automobile comprising: a printed circuit board(PCB); a bus bar; a plurality of module connectors for connecting thecontrol module to electronic components of the automobile; and asemiconductor package disposed between the bus bar and the PCB, thesemiconductor package comprising: a semiconductor integrated deviceencapsulated in a package housing having a first end with a width, and aplurality of leads, each lead having a first portion adjacent to andextending out of the package housing, wherein the first portions fitwithin the width of the package housing, wherein at least one of theplurality of leads is a source tab lead and at least one of theplurality of leads is a connection lead coupled to the PCB, wherein theconnection leads are configured to be attached as a surface mountconnection to a PCB, wherein the source tab lead passes through the PCBas a through hole connection to a module connector of the plurality ofmodule connectors.
 2. The control module of claim 1, wherein the moduleconnector has a width substantially greater than a width of any of thefirst portions.
 3. The control module of claim 1, wherein a heat sinkblade extends from a second end of the package housing, the heat sinkblade disposed between the bus bar and the package housing, the secondend of the package housing being opposite to the first end of thepackage housing along a vertical direction.
 4. The control module ofclaim 3, wherein the heat sink blade comprises a first portion parallelto the package housing and a second portion parallel to the bus bar, thefirst portion and the second portion being orthogonal to each other,wherein the connection lead bends to one side in a horizontal direction,and wherein the source tab lead bends in the opposite horizontaldirection.
 5. The control module of claim 1, wherein the source tab leadtransitions into a module connector of the plurality of moduleconnectors.
 6. A control module of an automobile comprising: a printedcircuit board (PCB); a bus bar; a semiconductor integrated deviceencapsulated in a package housing having a first end with a width, thepackage housing disposed between the bus bar and the PCB; a heat sinkblade disposed between the bus bar and the package housing; a pluralityof leads, each lead having a first portion adjacent to and extending outof the package housing, wherein the first portions fit within the widthof the package housing, wherein at least one of the plurality of leadsis a source tab lead and at least one of the plurality of leads is aconnection lead coupled to the PCB, wherein the connection leads areconfigured to be attached as a surface mount connection to a PCB; and aplurality of module connectors for connecting the control module toelectronic components of the automobile, wherein the source tab leadpasses through the PCB as a through hole connection to a moduleconnector of the plurality of module connectors.
 7. The control moduleof claim 6, wherein the source tab lead transitions into a moduleconnector of the plurality of module connectors.
 8. The control moduleof claim 6, wherein the heat sink blade extends from a second end of thepackage housing.
 9. The control module of claim 6, wherein the heat sinkblade comprises a first portion parallel to the package housing and asecond portion parallel to the bus bar, the first portion and the secondportion being orthogonal to each other.
 10. The control module of claim6, wherein the plurality of leads comprise a first set of connectionleads and a second set of connection leads, wherein the first set ofconnection leads bend to one side in a horizontal direction, and whereinthe second set of connection leads bend in the opposite horizontaldirection.
 11. The control module of claim 6, wherein the connectionlead bends to one side in a horizontal direction, and wherein the sourcetab lead bends in the opposite horizontal direction.
 12. A controlmodule of an automobile comprising: a printed circuit board (PCB); a busbar; a semiconductor integrated device encapsulated in a package housinghaving a first end with a width, the package housing disposed betweenthe bus bar and the PCB; a heat sink blade disposed between the bus barand the package housing, the heat sink blade extending from a second endof the package housing; and a first connection lead and a first sourcetab lead extending away from the first end of the package housing alonga vertical direction, the first connection lead having a first portionadjacent to the first end of the package housing, wherein the firstconnection lead is a surface mount connection to the PCB, wherein thefirst source tab lead has a neck portion adjacent to the first end ofthe package housing, and wherein a portion of the source tab lead is aconnection to a module connector through a through hole in the PCB. 13.The control module of claim 12, wherein the neck portion of the firstsource tab lead has a width less than the width of the first endproviding space for the first portion of the connection lead, andwherein the neck portion overlaps within the width of the first end ofthe package housing.
 14. The control module of claim 12, wherein theneck portion of the first source tab lead transitions into a moduleconnector, wherein the module connector has a width greater than thewidth of the neck portion of the first source tab.
 15. The controlmodule of claim 14, wherein a second portion has a width substantiallygreater than the width of the neck portion.
 16. The control module ofclaim 12, further comprising a second source tab lead, the first and thesecond source tab leads located on opposite sides of the firstconnection lead.
 17. The control module of claim 12, wherein the firstportion of the first connection lead and the neck portion of the firstsource tab lead extend side by side, wherein a second connection leadextends away from the first end of the package housing along thevertical direction, and wherein the first connection lead bends to oneside in a horizontal direction the second connection lead bends in theopposite horizontal direction.
 18. The control module of claim 12,wherein the first portion and the neck portion extend side by side andthe first connection lead bends to one side in a horizontal directionand the source tab lead bends in an opposite horizontal direction. 19.The control module of claim 12, wherein the heat sink blade extendsalong a surface of a bus bar.
 20. The control module of claim 12,wherein the package housing has a substantially uniform width from thefirst end to the second end.